Mike Konrad -
Contamination, Harsh Environments, and a New IPC Cleanliness Testing Standard -
The Perfect Storm of Change
With the rapid expansion of IOT, many circuit assemblies are now functioning in unfamiliar environments, many of these environments are harsh. Additionally, many new electronic applications control critical systems such as automotive electronics. This presentation focuses on the influence contamination plays on reliability of circuit assemblies, particularly when operated within harsh environments. Several contamination-related failure mechanisms will be presented including electro-chemical migration (dendritic growth, parasitic leakage) and conductive anodic filament (CAF). Methods to determine how clean is clean enough, including the new IPC J-STD-001-G Amendment 1 will be discussed.