Terry Munson -
Foresite

Presentation Abstract:

“Process Residues and their Impact on Product Reliability”

Review of 3 investigations and results of localized extractions and Ion Chromatography / IC/Mass Spec results from failed and good hardware to understand the cleanliness of the issues in specific areas and how the fabrication and process residues are causing the reliability issues. On inner layer shorting (CAF), brush cleaning post hand soldering, and cleaning with high pressure only water only under low standoff components.